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Product Details
  • image of IC Sockets>115-93-648-41-003000
  • image of IC Sockets>115-93-648-41-003000
Model 115-93-648-41-003000
Product Category IC Sockets
Manufacturer Mill-Max
Description CONN IC DIP SOC
Encapsulation -
Package Tube
RoHS Status
Price: $17.1200
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$17.1200

$958.7200

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image of IC Sockets>81908
81908
Model
81908
Product Category
IC Sockets
Manufacturer
Mill-Max
Description
CONN IC DIP SOC
Encapsulation
-
Package
Tube
lang_roHSStatusStatus
Product parameters
PDF(1)
PDF(2)
TYPEDESCRIPTION
MfrMill-Max
Series115
PackageTube
Product StatusACTIVE
FeaturesOpen Frame
Mounting TypeThrough Hole
TypeDIP, 0.6" (15.24mm) Row Spacing
Operating Temperature-55°C ~ 125°C
Number of Positions or Pins (Grid)48 (2 x 24)
TerminationSolder
Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30.0µin (0.76µm)
Contact Material - MatingBeryllium Copper
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin-Lead
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostBrass Alloy
Termination Post Length0.108" (2.74mm)
Current Rating (Amps)3 A
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