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Product Details
  • image of IC Sockets>123-13-324-41-001000
  • image of IC Sockets>123-13-324-41-001000
  • image of IC Sockets>123-13-324-41-001000
  • image of IC Sockets>123-13-324-41-001000
Model 123-13-324-41-001000
Product Category IC Sockets
Manufacturer Mill-Max
Description CONN IC DIP SOC
Encapsulation -
Package Tube
Quantity 3000
RoHS Status 1
Obtain Quotation
Price: $7.6000
Inventory: 3000
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Quantity

Price

Total Price

64

$7.6000

$486.4000

image of IC Sockets>31174
image of IC Sockets>31174
31174
Model
31174
Product Category
IC Sockets
Manufacturer
Mill-Max
Description
CONN IC DIP SOC
Encapsulation
-
Package
Tube
Quantity
1500
lang_roHSStatusStatus
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrMill-Max
Series123
PackageTube
Product StatusACTIVE
FeaturesOpen Frame
Mounting TypeThrough Hole
TypeDIP, 0.3" (7.62mm) Row Spacing
Operating Temperature-55°C ~ 125°C
Number of Positions or Pins (Grid)24 (2 x 12)
TerminationWire Wrap
Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30.0µin (0.76µm)
Contact Material - MatingBeryllium Copper
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post10.0µin (0.25µm)
Contact Material - PostBrass Alloy
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