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Product Details
  • image of IC Sockets>132-PRS14033-12
  • image of IC Sockets>132-PRS14033-12
Model 132-PRS14033-12
Product Category IC Sockets
Manufacturer Aries Electronics, Inc.
Description PGA ZIF TEST/BU
Encapsulation -
Package -
Quantity 3000
RoHS Status 1
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Price: $107.3100
Inventory: 3000
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$107.3100

$429.2400

image of IC Sockets>5347749
5347749
Model
5347749
Product Category
IC Sockets
Manufacturer
Aries Electronics, Inc.
Description
PGA ZIF TEST/BU
Encapsulation
-
Package
-
Quantity
1500
lang_roHSStatusStatus
1
Product parameters
TYPEDESCRIPTION
MfrAries Electronics, Inc.
SeriesPRS
Package-
Product StatusACTIVE
FeaturesClosed Frame
Mounting TypeThrough Hole
TypePGA, ZIF (ZIP)
TerminationSolder
Housing MaterialPolyphenylene Sulfide (PPS)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30.0µin (0.76µm)
Contact Material - MatingBeryllium Copper
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostBeryllium Copper
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