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JIQUN

Product Details
  • image of Solder>24-6337-8814
  • image of Solder>24-6337-8814
Model 24-6337-8814
Product Category Solder
Manufacturer Kester
Description SOLDER NO-CLEAN
Encapsulation -
Package Spool
Quantity 3050
RoHS Status
Obtain Quotation
Price: $40.9400
Inventory: 3050
Enter Quantity

Quantity

Price

Total Price

1

$57.8000

$57.8000

5

$52.9800

$264.9000

10

$45.7600

$457.6000

25

$40.9400

$1,023.5000

50

$38.5300

$1,926.5000

100

$36.1200

$3,612.0000

image of Solder>365519
365519
Model
365519
Product Category
Solder
Manufacturer
Kester
Description
SOLDER NO-CLEAN
Encapsulation
-
Package
Spool
Quantity
1550
lang_roHSStatusStatus
Product parameters
PDF(1)
PDF(2)
PDF(3)
TYPEDESCRIPTION
MfrKester
Series245
PackageSpool
Product StatusACTIVE
Diameter0.050" (1.27mm)
Wire Gauge16 AWG, 18 SWG
CompositionSn63Pb37 (63/37)
TypeWire Solder
Melting Point361°F (183°C)
FormSpool, 1 lb (454 g)
ProcessLeaded
Flux TypeNo-Clean
Storage/Refrigeration Temperature50°F ~ 104°F (10°C ~ 40°C)
Shelf Life StartDate of Manufacture
Shelf Life36 Months
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