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  • image of Embedded MCU, DSP Evaluation Boards>FORLINX-OKT507-C 152GSE8GIA10I11
  • image of Embedded MCU, DSP Evaluation Boards>FORLINX-OKT507-C 152GSE8GIA10I11
Model FORLINX-OKT507-C 152GSE8GIA10I11
Product Category Embedded MCU, DSP Evaluation Boards
Manufacturer Forlinx Embedded
Description ARM DEVELOPMENT
Encapsulation -
Package Tape & Box (TB)
Quantity 3001
RoHS Status 1
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Price: $165.0000
Inventory: 3001
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image of Embedded MCU, DSP Evaluation Boards>21691169
21691169
Model
21691169
Product Category
Embedded MCU, DSP Evaluation Boards
Manufacturer
Forlinx Embedded
Description
ARM DEVELOPMENT
Encapsulation
-
Package
Tape & Box (TB)
Quantity
1501
lang_roHSStatusStatus
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrForlinx Embedded
Series-
PackageTape & Box (TB)
Product StatusACTIVE
TypeMPU
ContentsBoard(s), Accessories
Core ProcessorARM® Cortex®-A53
Utilized IC / PartAllwinner T507
PlatformFORLINX-OKT507-C Development Board
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