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Product Details
  • image of Solder>SMDSWLF.006 1G
  • image of Solder>SMDSWLF.006 1G
Model SMDSWLF.006 1G
Product Category Solder
Manufacturer Chip Quik, Inc.
Description SOLDER WIRE SN9
Encapsulation -
Package Bulk
Quantity 3006
RoHS Status 1
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Price: $14.9500
Inventory: 3006
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image of Solder>15973931
15973931
Model
15973931
Product Category
Solder
Manufacturer
Chip Quik, Inc.
Description
SOLDER WIRE SN9
Encapsulation
-
Package
Bulk
Quantity
1506
lang_roHSStatusStatus
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrChip Quik, Inc.
Series-
PackageBulk
Product StatusACTIVE
Diameter0.006" (0.15mm)
CompositionSn96.5Ag3Cu0.5 (96.5/3/0.5)
TypeWire Solder
Melting Point423 ~ 428°F (217 ~ 220°C)
FormSpool, 0.035 oz (1g)
ProcessLead Free
Flux TypeNo-Clean, Water Soluble
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