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Product Details
  • image of Solder>SMDSWLF.020 4OZ
  • image of Solder>SMDSWLF.020 4OZ
Model SMDSWLF.020 4OZ
Product Category Solder
Manufacturer Chip Quik, Inc.
Description SLD WIRE NO-CLE
Encapsulation -
Package Spool
Quantity 3036
RoHS Status 1
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Price: $31.5700
Inventory: 3036
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image of Solder>2177058
2177058
Model
2177058
Product Category
Solder
Manufacturer
Chip Quik, Inc.
Description
SLD WIRE NO-CLE
Encapsulation
-
Package
Spool
Quantity
1536
lang_roHSStatusStatus
1
Product parameters
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PDF(2)
TYPEDESCRIPTION
MfrChip Quik, Inc.
Series-
PackageSpool
Product StatusACTIVE
Diameter0.020" (0.51mm)
Wire Gauge24 AWG, 25 SWG
CompositionSn96.5Ag3Cu0.5 (96.5/3/0.5)
TypeWire Solder
Melting Point423 ~ 428°F (217 ~ 220°C)
FormSpool, 4 oz (113.40g)
ProcessLead Free
Flux TypeNo-Clean, Water Soluble
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